In power plants and semiconductor industries, the requirements for pure water are high.The dissolved carbon dioxide in water will affect the water quality. Removing carbon dioxide before the EDI process of primary pure water can increase the produced water quality from 1.0 MΩ to 18.0 MΩ, which can greatly improve the silicon and boron removal rate of EDI produced water, reduce the pressure of terminal polishing mixed bed, and greatly improve the terminal water quality.

   In particular, pure water for industrial semiconductor wafers over 8 inches has higher requirements for the content of silicon and boron in water. That is because when pure water is used to clean the silicon wafers, the silicon in the water will be deposited on the surface of the silicon wafers, which will affect the quality of the thermal oxide layer, produce surface defects, and reduce the yield of devices. In order to make the terminal pure water quality meet the production requirements, it is necessary to strictly control the content of silicon and boron in the water at the primary pure water end. Otherwise, it would be difficult for the terminal polishing mixed bed to produce water that can meet the production requirements.

   The pharmaceutical industry also needs ultra-pure degassed water, because the dissolved gas will affect production efficiency and product quality. At the same time, the pharmaceutical industry needs to control the carbon dioxide in process water at a very low level in order to control the conductivity and PH value of water.

   The degassing membranes can reduce carbon dioxide in the water used for production processes in the semiconductor and pharmaceutical industries, reducing the concentration of carbon dioxide to improve the efficiency of the electrodeionization process.

   The method of removing carbon dioxide in water by a membrane is to let water flow in the hollow fiber membrane tube and change the pressure of gas outside the tube, such as reducing the solubility of oxygen and carbon dioxide in water by negative pressure or pressurization (adding pure N₂, etc.) to achieve the removal effect.

   This is a new application of membrane separation technology and a novel gas/liquid membrane separation process. According to the different decarburization accuracy requirements, three different operation modes of vacuum pumping, air purging, or vacuum pumping + air purging can be used to remove the dissolved carbon dioxide in the water down to 0.5 ppm.

   At the same time, the degassing membrane can not only remove carbon dioxide from the liquid but also add carbon dioxide to the liquid with precision and predictability. In semiconductor production, ultra-pure water should be used to avoid chip contamination since water is used for lubrication, cooling, and debris washing in the grinding wheel scribing process. Usually, it is necessary to inject a small amount of high-purity carbon dioxide gas into the water for foaming to reduce electrostatic damage, but the amount of carbon dioxide should be controlled. The use of degassing membrane added to the process flow can ensure the accurate expected concentration, and improve the scribing effect, thus saving time and simplifying the production process.

   Since the establishment of Guochu Technology (Xiamen) Co., Ltd., we have taken membrane separation technology as our core and are committed to promoting new separation technology.

    We will continue to explore new applications of the new degassing membrane technology in the fields of food, dairy, beverage, microelectronics, metallurgy, chemical industry, machinery, and environment to provide more users with professional gas separation solutions.